PlanetsX Flow / Pack/ Cool/ Warp (Thermosetting Resin)
Test ID
G-275
Description
Tests to generate properties required to perform a thermoset analysis with warpage in the PlanetsX software are included in this TestPak. This testing includes: parallel plate rheology at three temperatures, specific heat, transition analysis at three heating rates, transient thermal conductivity scan, and an isobaric PVT (pressure, volume, and temperature) temperature sweep on an uncured sample and a cured sample. Also modulus and Poisson ratio and CTE testing is performed. NOTE: DatapointLabs reserves the right to accept or reject any thermosets it feels would not produce viable data.
Included Tests
| 1x | M-101T | SIGMASOFT Mechanical Test |
| 1x | D-021 | PVT (Isobaric) |
| 1x | T-303 | Thermal Expansion Coefficient by TMA |
| 1x | R-022 | DMA Parallel Plate Dynamic Rheology (3 Temperatures) |
| 1x | T-010 | DSC Scan |
| 1x | T-015 | Specific Heat |
| 1x | T-103 | Thermal Conductivity Scan |
| 1x | R-027 | Cure Kinetics by DMA-isothermal |
Options
Samples
: 1 call
[details]Application
This data is used to perform the simulation of a thermosetting resin flowing into the mold and having packing pressure applied, curing inside the mold and simulating the warpage of the part when ejected from the mold.
