DIGIMAT EP+D Reverse Engineering

Test ID  
G-173RE

    
Description  
A DIGIMAT MX reverse engineering is performed. Fiber orientations obtained from a Moldflow simulation of the test plaque are combined with measured test data from the G-173 TestPak to reverse engineer a EP+D material card. This TestPak must be ordered with [G-173].    
Included Tests  
# Test Id Test Name
1x Z-998 Data Analysis
 
Options  
A Moldflow .udb material file is required for the reverse engineering. If this file does not exist, please order [G-007].  
Data  
DIGIMAT EP+D material card.  
Samples  
0 - none
 		   
Application  
Used to correlate the fiber orientation present in fiber-filled plastics with the structural stress-strain simulation model.