DIGIMAT EVP Reverse Engineering


Test ID

G-174RE

Description

A DIGIMAT MX reverse engineering is performed. Fiber orientations obtained from a Moldflow simulation of the test plaque are combined with measured test data from the G-174 TestPak to reverse engineer a J2_EVP material card. This TestPak must be ordered with [G-174].

Included Tests

1x Z-998 Data Analysis

Options

A Moldflow .udb material file is required for the reverse engineering. If this file does not exist, please order [G-007].

Samples

: 0 none

[details]

Application

Used to correlate the fiber orientation present in fiber-filled plastics with the structural stress-strain simulation model.

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