Moldflow/C-MOLD Post-Filling + Juncture Losses
Test ID
G-003
Description
Properties needed to perform a Moldflow mold-filling and packing simulation, incorporating pressure drops in runners and gates, are generated. These include Bagley corrected viscosity vs. shear rate at three temperatures (two in the processing range and one below); thermal properties, and PVT data. The entrance pressure loss (Bagley correction) is applied to the viscosity data; the residual contraction pressure loss is correlated to shear stress. Viscosity and PVT data are fit to Moldflow models.
Included Tests
| 1x | D-020 | PVT (Isothermal Heating) |
| 3x | R-012 | Capillary Rheology with Bagley Correction (1 Temperature) |
| 1x | R-018 | No-Flow Temperature |
| 1x | T-015 | Specific Heat |
| 1x | T-103 | Thermal Conductivity Scan |
Options
More advanced TestPaks are available to simulate shrinkage and warpage.
Samples
: 1 kg of pellets
[details]: 1 parts, any shape
[details]Application
In addition to all the software capabilities using Filling data, this TestPak enables the juncture loss calculation which permits the simulation of pressure drop across runners and gates due to extensional effects.
