DIGIMAT TEVP Reverse Engineering
Test ID
G-175RE
Description
A DIGIMAT MX reverse engineering is performed. Fiber orientations obtained from a Moldflow simulation of the test plaque are combined with measured test data from the G-175 TestPak to reverse engineer a J2_TEVP material card. This TestPak must be ordered with [G-175].
Included Tests
| 1x | Z-998 | Data Analysis |
Options
A Moldflow .udb material file is required for the reverse engineering. If this file does not exist, please order [G-007].
Samples
: 0 none
[details]Application
Used to correlate the fiber orientation present in fiber-filled plastics with the structural stress-strain simulation model.
