Moldlfow Filling, Packing, Cooling, Uncorrected Isotropic Shrinkage With Back Pressure (D3)G-033
Description
Properties needed to perform a Moldflow injection mold filling with back pressure dependency, packing, and shrink/warp simulation are generated. These include viscosity vs. shear rate at three temperatures (two in the processing range and one below), viscosity vs. shear rate with three levels of back pressure at three temperatures, thermal properties, PVT data. Additionally, tensile modulus and Poisson’s Ratio and thermal expansion coefficient are measured. Data are fit to Moldflow models including the D3 parameter for the Cross WLF model.
Included Tests
| 3x | R-011 | Capillary Rheology (1 Temperature) |
| 9x | R-033 | Capillary Viscosity with Back Pressure (D3 Testing) |
| 1x | T-015 | Specific Heat |
| 1x | T-103 | Thermal Conductivity Scan |
| 1x | T-303 | Thermal Expansion Coefficient by TMA |
| 1x | D-020 | PVT (Isothermal Heating) |
| 1x | M-013 | Orthotropic In-Plane Shear Modulus (Includes M-010, M-101) |
| 1x | M-017 | In-Plane Shear Modulus (Plate Twist Method) |
Samples
Application
A cost-saving alternative to the CRIMS model which may provide acceptable shrinkage estimates for unfilled, amorphous materials. In addition to all the capabilities of post-filling analysis, this TestPak enables calculations of shrinkage and warpage as well as the effect of back pressure on viscosity behavior.
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