SIGMASOFT Thermoset: Standard Filling + Curing + WarpageG-267
Description
Properties are generated to perform a simulation of the filling and cure, shrinkage, warpage and viscoelastic properties of thermoset epoxies and plastics. These include viscosity data by DMA at three temperatures where no reaction will occur and thermal conductivity and specific heat v. temperature, volumetric shrinkage through curing at 3 pressures, tensile properties at five temperatures and CTE. Cure kinetics are derived from isothermal and non-isothermal DMA measurements at three temperatures and heating rates in the processing range of the thermoset.
Included Tests
| 1x | M-101T | SIGMASOFT Mechanical Test |
| 3x | D-027 | Volumetric Cure Shrinkage |
| 1x | T-303 | Thermal Expansion Coefficient by TMA |
| 1x | R-022 | DMA Parallel Plate Dynamic Rheology (3 Temperatures) |
| 1x | T-015 | Specific Heat |
| 1x | T-103 | Thermal Conductivity Scan |
| 3x | R-027 | Cure Kinetics by DMA-isothermal |
