SIGMASOFT Elastomer: Standard Filling + Curing + Shrinkage/WarpageG-268M
Description
This TestPak generates the properties needed to perform a simulation of the filling, curing and warpage and shrinkage of the molding of rubber and other reactive elastomers. These include viscosity data by DMA at three temperatures where no reaction will occur, as well as thermal conductivity and specific heat vs. temperature, specific volume versus temperature at three isobaric pressures, coefficient of thermal expansion and modulus of elasticity and Poisson's ratio. Cure kinetics are derived from isothermal DMA measurements at three temperatures in the processing range of the elastomer. Test data is fit to SIGMASOFT specific material models and formatted database file.
Included Tests
| 3x | D-027 | Volumetric Cure Shrinkage |
| 1x | R-022 | DMA Parallel Plate Dynamic Rheology (3 Temperatures) |
| 3x | R-027 | Cure Kinetics by DMA-isothermal |
| 1x | T-015 | Specific Heat |
| 1x | T-103 | Thermal Conductivity Scan |
| 1x | T-303 | Thermal Expansion Coefficient by TMA |
| 1x | M-101 | Poisson’s Ratio and Tensile Modulus |
Samples
Application
This TestPak provides material data inputs for elastomeric reactive filling analysis simulations in SIGMASOFT. With this package one is able to simulate the filling of a mold cavity, packing of the mold, curing of the elastomer material in the mold and the ejection of the finished part.
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