Testing for adhesive

Test methods for the characterization of flow properties of hot melt adhesives by capillary rheometer. Properties of pressure sensitive films including visco-elastic and stress relaxation properties that provide information on time-dependent and long term behavior, Failure characteristics such as lap shear and butt joint data that can be used to model cohesive elements in computer simulations. Cure characteristics of reactive adhesives such as epoxy, silicones using dynamical mechanical methods and DSC.

TestPaks typically ordered for adhesive

Testpak ID Name
G-268 SIGMASOFT Elastomer: Standard Filling + Curing
G-006 Moldflow/C-MOLD Uncorrected Isotropic Shrinkage

Tests typically ordered for adhesive

Test ID Name
M-043 Peel Test
M-041 Lap Shear Strength
T-303 Thermal Expansion Coefficient by TMA
T-010 DSC Scan
R-011 Capillary Rheology (1 Temperature)
T-015 Specific Heat
T-107 Thermal Conductivity by Guarded Heat Flow Meter (Single Point)
T-103 Thermal Conductivity Scan
R-020 DMA Cone and Plate Dynamic Rheology (1 Temperature)
R-028 Cure Kinetics by DMA -non isothermal
Testing for adhesive
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