Moldflow Thermoset Lite (Filling, Curing, No Shrinkage/Warpage)
G-010L
Description
Testing required to generate a Moldflow .20030udb file. This testing includes three temperatures of parallel plate rheology, three heating rates of curing viscosity at three shear rates as well as specific heat, thermal conductivity, density of and un-cured material. Please note that BMC and RIM materials are not currently possible to test.
Included Tests
| 1x | R-022 | DMA Parallel Plate Dynamic Rheology (3 Temperatures) |
| 9x | R-028 | Cure Kinetics by DMA -non isothermal |
| 1x | T-015 | Specific Heat |
| 1x | T-108 | Thermal Conductivity by Guarded Heat Flow Meter (Scan) |
| 1x | D-010 | Solid Density |
| 1x | Z-998 | Data Analysis (Injection molding) |
Samples
Application
Used to characterize materials that cure during the molding process. Due to the wide range of curable materials it may or may not be possible to test all materials. The lab will advise if a specific type of material is not possible to characterize.
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